| ??? 03/21/06 10:48 Read: times |
#112661 - xGA is a charm Responding to: ???'s previous message |
The reliability problems that you and RE are facing are unbelievable.
To sucessfully manufacture a BGA or LGA PCB not only the device but also the package datasheet has to be understood. Landing pads are crucial, for both packages the PCB surface handling is crucial and for LGA the amount of solder paste is also crucial. And then the heating profile. Stick to the manufacturers package datasheet and save a lot of trouble. Never had any problems with BGA/LGA packages and migrating more and more components. And yes, RoHS. Cheers, Roger |
| Topic | Author | Date |
| land grid array | 01/01/70 00:00 | |
| BGA | 01/01/70 00:00 | |
| Yes, indeed! | 01/01/70 00:00 | |
| unbelievable | 01/01/70 00:00 | |
| well | 01/01/70 00:00 | |
| xGA is a charm | 01/01/70 00:00 | |
| ha ha | 01/01/70 00:00 | |
| I wish I'd known you when, | 01/01/70 00:00 | |
It's a matter of cost. | 01/01/70 00:00 |