The teensy reduction in mfg cost moving from leaded to BGA packages reduces yields in assembled/tested boards made in the U.S. at anything but ultra-premium rates to somewhere on the order of 1%. That means that, by the time I get assembled boards back, I have 1 useable board for every hundred boards and component kits I started with. That's not very economical. It basically forces me to use Asian manufacturers, who will build better boards for less money, but which, in turn, ensures I'll have a competitor who can build my product without recovering the NRE cost within a week or two.

This technology is great for cellphone makers who have to have the small size, but the risks and costs are ridiculous.

RE